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SI/PI/EMC analysis

Signal Integrity


    • Experience of handling prelayout & postlayout designs/topologies helps customer to first time right designs.

    • Successfully executed complex Multidrop/Multipoint topologies.

    • Asserting PCB layer stackup/Layer ordering/PCB materials based on SI results.

    • Validating the logic level, Drive strengths, Termination techniques, Thresholds, Over/Under shoot, Propagation Delay, Noise margin etc., Slew Rate, Timing Budget(setup/Hold time), EYE Diagram.、

    • BER, ISI, Jitter, Loss(IL,RL) analysis.

    • Cross talk analysis and mitigation methodologies.

    • SerDes/DDRx/XAUI/PCIe interfaces.

    • Handled upto 12.5Gb speed.




SI-Signal Integrity

Signal  Integrity

Prelayout & postlayout designs/topologies

BER, ISI, Jitter, Loss(IL,RL) analysis.

Cross talk analysis

Timing Budget(setup/Hold time), EYE Diagram

Complex Multidrop/Multipoint topologies

PI-Power Integrity

Power Integrity

IR/DC Drop analysis

Voltage/Current Density

3D plots Decoupling Analysis with Frequency

V/S Impedance plotPlane

Noise Analysis with 3D plot of plane noise

EMC

EMC Analysis

Frequency V/S dB plot for Different standards

RE/CE analysis

RI/CI analysis

3D Magnetic/Electric & Current density Plots

Noise Analysis with 3D plot of plane noise

DFM-Design for Manufacture

Design for manufacture

DFM Analysis

DFA Analysis

DFT Analysis




信号Signal Integrity


    • Experience of handling prelayout & postlayout designs/topologies helps customer to first time right designs.

    • Successfully executed complex Multidrop/Multipoint topologies.

    • Asserting PCB layer stackup/Layer ordering/PCB materials based on SI results.

    • Validating the logic level, Drive strengths, Termination techniques, Thresholds, Over/Under shoot, Propagation Delay, Noise margin etc., Slew Rate, Timing Budget(setup/Hold time), EYE Diagram.

    • BER, ISI, Jitter, Loss(IL,RL) analysis.

    • Cross talk analysis and mitigation methodologies.

    • SerDes/DDRx/XAUI/PCIe interfaces.

    • Handled up to 12.5Gb speed.





Analysis Item
  Layer2-64L
Thickness0.5-17.5mm
Min M0.1mm
Hole 3mil
  HDI1+n+1\2+n+2\3+n+3

Power Integrity analysis





Design For Fabrication Anaysis


The DFF is a process of optimizing the design data so that it can be the manufactured at least cost without sacrificing the design intent.

DFA Analysis helps you to resolve manufacturability issues, increases reliability,

reduces rework cost and most importantly helps you to meet “TIME TO MARKET”